CL21B822KB6SFNC
Производитель: | Samsung Electro-Mechanics America, Inc. |
Описание: | Boardflex Sensitive; 8200pF; -; Soft Termination; -; -; -; Surface Mount, MLCC; -55°C ~ 125°C; 0805 (2012 Metric); Digi-Reel® Alternate Packaging; -; This part is RoHS compliant.; CL; 0.079" L x 0.049" W (2.00mm x 1.25mm); X7R; 0.028" (0.70mm); ±10%; 50V; |
Аналоги % соответствия |
Product Attributes | |
---|---|---|
50%
|
Applications | Boardflex Sensitive |
50%
|
Capacitance | 8200pF |
50%
|
Failure Rate | - |
50%
|
Features | Soft Termination |
50%
|
Height - Seated (Max) | - |
50%
|
Lead Spacing | - |
50%
|
Lead Style | - |
50%
|
Mounting Type | Surface Mount, MLCC |
50%
|
Operating Temperature | -55°C ~ 125°C |
50%
|
Package / Case | 0805 (2012 Metric) |
50%
|
Packaging | Digi-Reel® Alternate Packaging |
50%
|
Ratings | - |
50%
|
RoHS | This part is RoHS compliant. |
50%
|
Series | CL |
50%
|
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
50%
|
Temperature Coefficient | X7R |
50%
|
Thickness (Max) | 0.028" (0.70mm) |
50%
|
Tolerance | ±10% |
50%
|
Voltage - Rated | 50V |